Product

Processing

发布时间: 2016/08/03 08:50,类别: Product

Self-developed key technologies for silicon carbide ingot & wafer processing: select the appropriate abrasive materials and appropriate processing recipe to slice, grind, polish and CMP silicon carbide ingots & wafers, obtained good flatness and surface quality silicon carbide wafers which are applicable for the use of epitaxial and device customers.

天科关键技术-1.jpg

天科关键技术-2.jpg

Scan To Follow Us Wechat
Tel: +86-010-59944178